Rare earth-oxides, rare earth -nitrides, rare earth -phosphides and ternary alloys with silicon

ABSTRACT

Atomic layer epitaxy (ALE) is applied to the fabrication of new forms of rare-earth oxides, rare-earth nitrides and rare-earth phosphides. Further, ternary compounds composed of binary (rare-earth oxides, rare-earth nitrides and rare-earth phosphides) mixed with silicon and or germanium to form compound semiconductors of the formula RE-(O, N, P)—(Si,Ge) are also disclosed, where RE=at least one selection from group of rare-earth metals, O=oxygen, N=nitrogen, P=phosphorus, Si=silicon and Ge=germanium. The presented ALE growth technique and material system can be applied to silicon electronics, opto-electronic, magneto-electronics and magneto-optics devices.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims benefit of U.S. provisional patent applicationSer. No. 60/533,378 filed on 29 Dec. 2003, and is also acontinuation-in-a-part of U.S. Ser. No. 10/825,974 filed Apr. 16, 2004,which is a continuation of U.S. Ser. No. 10/666,897 filed Sep. 17, 2003,which is a divisional of 09/924,392 filed Aug. 7, 2001, which claims thebenefit of U.S. Ser. No. 60/223,874 filed Aug. 8, 2000, all of whichapplications are w herein incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates generally to compositions, structures and devicesfor silicon-on-insulator (SOI) compositions, devices and applications,and more particularly to compositions, structures and devices utilizingsubstantially single crystal compositions for SOI compositions, devicesand applications.

2. Description of the Related Art

It is well known that pure crystal or single-crystal rare-earth oxides(REOx), rare-earth nitrides (REN) and rare-earth phosphides (REP) do notoccur in nature, nor can they be grown using prior-art growthtechniques. For this reason, single crystalline oxides, nitrides andphosphides compatible and functionalized for use with ultra large scaleintegrated (USLI) silicon electronics processing has to date eluded thesilicon electronics industry. In contrast, amorphous oxides arecomparatively straightforward to realize. Modern silicon electronicsowes a large part of the enormous success to the robust native oxide ofsilicon, that is, stoichiometric silicon dioxide (SiO₂). The crystallineSi and amorphous SiO₂ interface can be prepared as an almost perfectdefect free interface. The high quality of the Si/SiO₂ interface isdifficult to replicate in practically any other material system.

This inability to create single-crystal oxides affects three majorapplication areas as recited hereafter.

Future ULSI technology node scaling into the deep sub-micron regimerequires ultrathin gate oxides of SiO₂ for use in field effecttransistors (FETs) to be of the order of 1-10 nanometers in thickness.Unfortunately, fundamental physics problems at such small SiO₂ thicknessappear: (i) large quantum mechanical tunneling gate current; (ii)dielectric breakdown; and (iii) reliability degradation. These problemsrequire alternate gate materials, (such as higher dielectric constantoxides) and modified Si substrates, such as silicon-on-insulator (SOI),to be introduced into ULSI technology nodes.

Complementary to the Si electronics industry is the demand forsemiconductor materials which are optically active and compatible withSi processing technology. To date there does not exist a clear answer tothis Si industry compatibility issue for optoelectronic materials.Efficient and inexpensive electrically driven planar photonic Si-baseddevices operating at fiber communications wavelengths are the drivingrationale for solving optoelectronic integration with mainstream Sielectronics. One path toward such a goal is the creation of a materialthat can be relatively easily fabricated and integrated with Si-basedULSI electronics manufacturing. This philosophy is a potential solutionfor reducing optoelectronic system manufacturing costs. Further,optoelectronic emitters and absorbers operating at 1.5 micronwavelengths that are readily integrable with silicon electronics offeran explosive increase in functionality and reduction in cost/function.Using the present invention, active and passive photonic elements can beintegrated along side, above or beneath planar complementary metal oxidesemiconductor (CMOS) electronics. For example, U.S. Pat. No. 6,734,453,describes how a single crystal photonic layer can be buried beneath anactive CMOS layer. This approach allows the photonic and electroniclayers to be separately optimized. Furthermore, silicon-based rare-earthcontaining multi-layers are disclosed.

Finally, there is also a demand for higher density and function magneticstorage materials. Simplistically, a magnetic media which can beprocessed using ULSI tools is of great interest. However, once again aclear answer does not presently exist. The present invention allows theuse of high densities of magnetic rare-earth ions in a single crystalform. The utility of the said magnetic single crystal, for examplesingle crystal rare-earth oxide, is that can be: (i) deposited as a thinfilm compatible with silicon; and (ii) the possibility of using siliconmicroelectronics for electrical read/write access for the storage ofinformation using the intrinsic properties of the confined magneticions.

There are primarily two critical mainstream Si electronics issues inareas of ULSI FET gate oxides and silicon-on-insulator materials. Thetwo areas have been historically separate concerns and are elegantlyrelated for the first time using present invention. The presentinvention potentially solves both areas individually and/or allows anintegrated approach by virtue of the unique fact the present inventionis: (i) single crystal; (ii) a high-k dielectric; (iii) commensuratewith and may be epitaxially deposited with substantially single crystalsilicon; and further (iv) multilayers of single crystal silicon andsingle crystal rare-earth oxides may be deposited at will.

A possible solution to the USLI gate oxide problem, is the substitutionof SiO₂ with a material of higher dielectric constant, so-called “high-kdielectrics”. A possible short-term dielectric material is theincorporation of nitrogen in SiO₂ to form silicon oxynitride(SiO_(x)N_(y)). Possible candidate long term high-k solutions are oxidesof titanium oxide (TiO₂), tantalum pentoxide (Ta₂O₅), halfnium oxide(HfO₂), zirconium oxide (ZrO₂) and aluminum oxide Al₂O₃. Alloys and/orcombinations of the above materials may also prove effective inleveraging advantageous features of each high-k binary oxide, such asHfZrO₄. Similarly, high-k binary oxides combined with SiO₂ or Si, suchas zircon HfSiO₄ or HfSiO₂, may also prove to be effective gate oxides.

However, to date all such alternative gate oxide candidates mentionedabove fail in one or more areas of required device performance.

These areas include (i) bulk gate material quality; (ii) silicon/gateoxide interface quality; (iii) gate material conduction and valence bandoffsets with respect to bulk Si; (iv) breakdown strength; (v) gate oxideband gap; and (vi) growth technique. Further, practically alltechnologically relevant oxides investigated as possible replacementgate materials to date are either amorphous or at best polycrystalline.Worthy of note is the perovskite-like crystal, strontium titanate,SrTiO₃ (STO). This particular compound can be grown with limitedthickness as a single crystal on Si(001)-oriented wafers. However,crystallinity in this case is not sufficient criterion for FET gateoxide suitability. Unfortunately, the silicon/STO hetero-junction offsetis almost entirely located in the valence band- and therefore isunsuited to Si-based ULSI FET devices.

One current growth technique for precise ultrathin oxide layerdeposition is a variant of well established chemical vapor deposition(CVD) techniques. Gate oxide layer thickness of the order 1-10nanometers (nm) requires a complex pulsed reactive hydride and chlorideprecursor gas based deposition/purge cycle CVD process based on U.S.Pat. No. 4,058,430—presently termed atomic layer deposition (ALD).Recent success of the ALD process for demonstration of ultrathin oxidesmentioned above, unfortunately neglects specific problems related topractical ULSI device issues:

Central to the inadequacy of SiO₂ as a viable ultrathin gate oxide isthe presence of impurities, primarily those related to hydrogen, whichare responsible for premature failure and low breakdown voltages in ULSIdevices. Therefore, it is unclear how hydride and chloride basedprecursor ALD solves this issue.

The issue of interface quality is typically not addressed, that is, theinterfacial quality of bulk Si/high-k oxide. Typically, the interfacialquality and/or defect density is inferior to that of the Si/SiO₂ systemand therefore FET channel and threshold voltage performance iscompromised.

The important issue of electron confinement is understated in thepursuit of high-k gate dielectrics. Of central importance is the energybarrier presented to electrons and holes at the interface between twodissimilar semiconductors, namely, the gate oxide and bulk Si, hereafterreferred to as a hetero-junction. The hetero-junction conduction bandoffset between the high-k oxide and bulk Si is typically less than theSiO₂/Si system. Therefore, thermionic emission of electrons across thepotential barrier is greater in the Si/high-k heterojunction.

Regardless of the final ULSI implementation of high-k gate oxide(s),silicon-on-insulator (SOI) substrates are a key technology for highperformance ULSI. To date, practical implementation of SOI substratescan be classed as the following forms, (i) a thin single crystallinesilicon layer separated from the silicon bulk substrate by an amorphousSiO₂ layer, forming the insulator and (ii) a thin layer ofre-crystallized or deposited Si onto a glass or wide bandgap substrate,such as sapphire. Both forms are required to exhibit:, (i) high qualitysingle crystal Si surface active layer; (ii) high uniformity and a lowdefect density active Si layer, and (iii) a high uniformity and lowleakage insulator.

The first form of SOI conceptually consists of a thin silicon activelayer upon a SiO₂ buried oxide (BOX) insulator layer substantiallydisposed across a bulk Si substrate. The BOX layer is typically formedusing two fabrication methods. One method uses primarily high energyoxygen implantation through the surface of the silicon to an appropriatedepth and profile, followed by an aggressive thermal anneal processes inorder to recrystallize the surface damaged active Si layer to singlecrystal Si. This technique is known as the separation by implantation ofoxygen process (SIMOX). Another method uses substantially wafer bondingof two separately oxidized silicon wafer surfaces that are brought intointimate contact and annealed to form a BOX layer. Once the twosubstrates have been joined, one of the silicon substrates in thenphysically reduced in thickness in a direction from one of the exteriorsilicon surfaces toward the BOX layer. This is achieved by chemicalmechanical polishing (CMP) and or etching, or via physical abrasion downto the active Si layer thickness required. A variant on the waferbonding approach is to use atomic layer cleaving, via hydrogenimplantation of a buried defect layer. Upon annealing the hydrogen formsa preferential cleaving plane and a large portion of the sacrificialsilicon substrate can be removed.

However, extensive CMP is still required to form a uniform flat activesilicon layer surface. Both forms of SOI, however, share the unfavorableproperties that the Si/buried oxide interface is highly defective and isnot usable as a lower gate dielectric layer for FET devices. Secondly,both forms of SOI are presently costly to produce and it is this factthat hinders wider acceptance of SOI technology in present and futureULSI processes. Thirdly, conventional SOI fabrication technologies aretime consuming and physically require many serial processing andcleaning steps. Fourthly, active Si layer thickness required for fullydepleted SOI, typically less than or equal to 500 Angstroms, areextremely difficult to realize. Finally, the BOX thickness is requiredto be relatively thin.

To date general deposition techniques have been used to explore RE-oxidethin films on Si substrates. In one method, light rare earth metals,occurring at the beginning of the rare-earth sequence in the periodictable of elements, have been utilized. Light metal rare-earth oxideshave been demonstrated by electron-beam evaporation (EBE) of a singlestoichiometric RE-oxide target. The disadvantage of this technique isstoichiometry of the target does not ensure stoichiometry of theresulting deposited thin film oxide. Most notable prior art using EBEare Y₂O₃, Pr₂O₃ and Gd₂O₃ thin films.

Y₂O₃ and Pr₂O₃ have been deposited on silicon substrates and arepredominately polycrystalline and or amorphous in nature when depositedon Si(001) oriented substrates. Single crystal thin films have not beendemonstrated on Si(001)-oriented substrates.

A further disadvantage of this technique is that prolonged use of thesingle source EBE rare-earth oxide results in unfavorablerare-earth-to-oxygen ratio variation. Yet another disadvantage of thistechnique is the lack of evaporant flux control by virtue of the EBEprocess. Yet a further disadvantage of this technique is theintroduction of charged species/defects that affect trapped oxide chargein an unfavorable manner. The later point is crucial to the performanceof FET devices.

In a second method, the deposition of light rare-earth metal oxides isachieved using high vacuum environment deposition, unexcited molecularoxygen gas and EBE of elemental light rare-earths. An example of thismethod is found in U.S. Pat. No. 6,610,548, which describes a two sourcedeposition technique using vacuum EBE of Cerium rare-earth sourcematerial and unexcited molecular oxygen gas. Disclosed are ceriumdioxide CeO₂ rare earth oxide layers grown on Si substrates at growthtemperatures ranging 100<T_(growth)<300 deg C.

It has been known for well-over a decade that clean (001)-orientedsurfaces of Si and Ge exhibit 2×1 reconstructions. Using typical surfaceanalysis tools in a suitable environment, (such as reflection highenergy diffraction, i.e.: RHEED, and high vacuum conditions), two 2×1reconstructions rotated by 90° are typically observed when the nativeSiO₂ oxide is removed. An ideal Si surface of a diamond latticestructure represents an non-terminated Si (001)-oriented surface. Eachface Si atom will have two dangling bonds. The 2×1 reconstruction is dueto a minimization of surface energy and a pairing of atoms inneighboring rows occurs, i.e., dimerization. Two orthogonally oriented2×1 domains which are typically observed can be understood as dimers onterraces which are separated by single atomic layer steps of heightequal to one quarter the bulk Si crystal lattice constant. RHEEDdiffraction patterns which show one 2×1 domain only, should then beobserved in samples which exhibit ether (i) no steps or (ii) bi-layersteps of height equal to half the bulk Si lattice constant.

Single-domain Si(001) surfaces are easily obtained by preparing a Sisurface which are intentionally misoriented from the idealSi(001)-orientation. Typically, miscut substrates of approximately 1 to6 degrees misoriented towards [110] can be used for this purpose.

U.S. Pat. No. 6,610,548 discloses the growth of amorphous and orpolycrystalline growth of cerium dioxide on Si(001)-oriented substrateswith a mixed 2×1 and 1×2 prepared surface. Following an oxide depositionis a high temperature anneal for recrystallization of the lightrare-earth oxide, so that the crystal quality can be improved. Thepresence of initial amorphous silicon oxide and or amorphous ceriumoxide initial layers in the growth sequence toward a finalpolycrystalline cerium oxide layer is completely different to thebehavior observed in the present invention using technique 4, discussedlater.

A major disadvantage of aforementioned techniques, as discussed in U.S.Pat. No. 6,610,458, is the limitation to the type of rare-earth oxidethat can be used. Cubic structure crystallizations of rare-earth oxidesof the formula REO₂ are accessible, in general, to only the lighterrare-earth metals. The present invention teaches that beyond Ce, as theatomic number increases, most energetically favorable crystallizationsare of the formula RE₂O₃. If fact, cubic rare-earth crystals will havesignificant net charge defect due to the multiplicity of rare-earthoxide oxidation state-thereby rendering such oxides inapplicable to highperformance FET devices. Annealing such structures will result in mixedcrystal phases, that is, polycrystallinity.

In a third method, a form of chemical vapor deposition is employed usingmolecular metal-organic precursors. Thin films of RE-oxides have beendeposited on Si substrates by using a pyrolysis method. In this methodthin organic films can be deposited using rare-earth metal which isattached to an acetylacetonate complex, namely RE(CH₃COCHCOCH₃)₃H₂O, andevaporarted under medium vacuum conditions (>10⁻⁶ torr) in a tungstencrucible. The resultant films are similarly plagued by amorphous and orpolycrystal RE-oxide phases. The same arguments outlined in theintroduction of this paper, relating to precursor ALD process, alsoholds for this metal-organic deposition technique.

Erbium oxide has been deposited on Si substrates using medium vacuumlevel electron-beam evaporation of a single Er₂O₃ target material andhigh pressure metalorganic chemical vapor deposition (MOCVD) using aprecursor of tris (2,4-pentadionato) (1,100-phenanthroline) erbium(III)[Er(pd)₃.Phen. The deposited thin film material quality in both of theabove growth methods, namely EBE and MOCVD, exhibited amorphous phasesof erbium oxide and at best poorly polycrystalline material. Singlecrystal erbium-oxide films has not been demonstrated and or claimed asbeneficial in prior art. Similarly, single crystal rare-earth oxide andsilicon multilayers have not been demonstrated.

In summary, using EBE of a chemically stoichiometric rare-earth oxidesingle target or rare-earth organic precursor, in general, does notensure the correct deposited film stoichiometry. This results inamorphous and or polycrystalline rare-earth oxide thin film. Departurefrom stoichiometry in the film deposition structure results generally instrongly disordered structures.

Accordingly, there is a need for improved silicon-on-insulator (SOI)compositions, devices and applications. There is a further need forsubstantially single crystal SOI compositions, devices and applications.

SUMMARY OF THE INVENTION

An object of the present invention is to provide improvedsilicon-on-insulator (SOI) compositions, devices and applications.

Another object of the present invention is to provide substantiallysingle crystal SOI compositions, devices and applications.

A further object of the present invention is to provide substantiallysingle-crystal rare-earth oxides, rare-earth nitrides and rare-earthphosphides.

Yet another object of the present invention is to provide substantiallysingle-crystal rare-earth oxides, rare-earth nitrides and rare-earthphosphides that are formed on silicon, germanium or silicon-germanium(SiGe) wafers.

Another object of the present invention is to provide high quality,single-crystal silicon over substantially single-crystal rare-earthoxides, rare-earth nitrides and rare-earth phosphides structures.

Still another object of the present invention is to epitaxially growhigh-quality silicon on insulator wafers, with crystalline qualityexceeding those currently available.

A further object of the present invention is to create substratematerials used in the manufacture of integrated circuits that containmultifunction circuit elements that, if grown on conventionalsubstrates, would otherwise not be possible.

Yet another object of the present invention is to provide crystallinewide band gap rare-earth oxide or nitride or phosphide materials in lowdimensional confinement high electron or hole mobility transistors.

Still another object of the present invention is to provide multi-layercrystalline Si onto thick and thin films of single crystal erbium oxide.

Still another object of the present invention is to provide multi-layerthick and thin film constructions consisting of crystalline Si andsingle crystal erbium oxide.

Yet another disclosure of the present invention is to provide epitaxialdeposition of rare-earth nitrides and rare-earth phosphides binarysemiconductors formed by epitaxial deposition.

Yet another object of the present invention is to provide multi-layercrystalline Si onto thick and thin films of single crystal rare-earthoxide and or rare-earth nitride and or rare-earth phoshide.

Yet another object of the present invention is to provide multi-layerthick and thin film constructions consisting of crystalline silicon andsingle crystal rare-earth oxide and or rare-earth nitride and orrare-earth phoshide.

Another object of the present invention is to provide compositions ofthe formula:

-   -   [RE]_(x)[O]_(y), where x and y are positive real numbers, RE is        at least one type of rare-earth metal atom, and a majority of        the composition is a single crystal, as well as associated SOI's        and other structures incorporating the compositions.

A further object of the present invention is provide binarysingle-crystal rare-earth nitride compositions of the formula:RE_(x)N_(y) where x and y are positive real numbers, RE is at least onetype of rare-earth metal atom, and a majority of the binary rare-earthnitride is single crystal, as well as associated SOI's and otherstructures incorporating the compositions.

Yet another object of the present invention is provide binarysingle-crystal rare-earth phosphide compositions of the formula:RE_(x)P_(y) where x and y are positive numbers, RE is at least one typeof rare-earth metal atom, and a majority of the binary rare-earthphosphide is single crystal, as well as associated SOI's and otherstructures incorporating the compositions.

Still a further object of the present invention is to provide rare-earthoxy-nitride ternary compositions of the formula [RE]_(x)[O_(1-z)N_(z)]_(y), where x, y and z are positive real numbers, RE is atleast one type of rare-earth metal atom, and a majority of thecomposition is single crystal, as well as associated SOI's and otherstructures incorporating the compositions.

Still a further object of the present invention is provide rare-earthoxy-nitride ternary compositions of the formula[RE]_(x)[O_(1-z)N_(z)]_(y), where x, y and z are positive real numbers,RE is at least one type of rare-earth metal atom, and a majority of thecomposition is either single crystal, polycrystalline or amorphous, aswell as associated SOI's and other structures incorporating thecompositions.

Another object of the present invention is provide silicon rare-earthoxide nitride, phosphide ternary and or quaternary alloy compositions ofthe formula:

-   -   [(RE)_(x) (O or N or P)_(y)] [Si or Ge or SiGe]_(z), where RE is        at least one type of rare-earth metal, where x, y and z are        positive real numbers, and a majority of the composition is a        single crystal.

These and other objects of the present invention are achieved in a highdielectric (k) constant structure for an integrated circuit thatincludes first and second dielectric layers. At least one of the layersis a high-k dielectric layer made of a rare-earth oxide of the formula:

-   -   [RE]_(x) [O]_(y), where x and y are real positive numbers less        than or equal to 5, RE is at least one type of rare-earth metal        atom and a majority of the composition is a single crystal. A        first semiconductor layer is positioned between the first and        second dielectric layers.

In another embodiment of the present invention, a transistor gatedielectric structure for an integrated circuit includes first and seconddielectric layers. At least one of the layers is made of a binarysingle-crystal rare-earth nitride of the formula:

-   -   RE_(x)N_(y) where x and y are real positive numbers less than or        equal to 2, RE is at least one type of rare-earth metal atom,        and a majority of the binary rare-earth nitride is single        crystal. A first semiconductor layer is positioned between the        first and second dielectric layers.

In another embodiment of the present invention, a high-k dielectricstructure for an integrated circuit includes first and second dielectriclayers. At least one of the layers is a high-k dielectric layer made ofa binary single-crystal rare-earth nitride of the formula:

-   -   RE_(x)N_(y) where x and y are real positive numbers, RE is at        least one type of rare-earth metal atom, and a majority of the        binary rare-earth nitride is single crystal. A first        semiconductor layer is positioned between the first and second        dielectric layers.

In another embodiment of the present invention, a transistor gatedielectric structure for an integrated circuit includes first and seconddielectric layers. At least one of the layers is made of a binarysingle-crystal rare-earth phosphide of the formula:

RE_(x) P_(y) where x and y are real positive numbers, RE is at least onetype of rare-earth metal atom, and a majority of the binary rare-earthphosphide is single crystal. A first semiconductor layer is positionedbetween the first and second dielectric layers.

In another embodiment of the present invention, a high-k dielectricstructure for an integrated circuit includes first and second dielectriclayers. At least one of the layers a high-k dielectric layer made of abinary single-crystal rare-earth phosphide of the formula

-   -   RE_(x) P_(y) where x and y are real positive numbers, RE is at        least one type of rare-earth metal atom, and a majority of the        binary rare-earth oxide is single crystal. A first semiconductor        layer is positioned between the first and second dielectric        layers.

In another embodiment of the present invention, a transistor gatedielectric structure for an integrated circuit includes first and seconddielectric layers. At least one of the layers is made of a rare-earthoxy-nitride ternary of the formula

-   -   [RE]_(x) [O_(1-y) N_(y)]_(z), where x, y and z are real positive        numbers less than or equal to 5, RE is at least one type of        rare-earth metal atom, and a majority of the insulator layer is        single crystal. A first semiconductor layer is positioned        between the first and second dielectric layers.

In another embodiment of the present invention, a high-k dielectricstructure for an integrated circuit includes first and second dielectriclayers. At least one of the layers is a high-k dielectric layer made ofa rare-earth oxy-nitride ternary of the formula

-   -   [RE]_(x) [O_(1-z)N_(z)]_(y) where x, y and z are real positive        numbers less than or equal to 5, RE is at least one type of        rare-earth metal atom, and a majority of the dielectric layer is        single crystal. A first semiconductor layer is positioned        between the first and second dielectric layers.

In another embodiment of the present invention, a transistor gatedielectric structure for an integrated circuit includes first and seconddielectric layers. At least one of the layers is made of a siliconrare-earth oxide, nitride, phosphide ternary or quaternary alloy of theformula:

-   -   [(RE)_(x) (O and or N and or P)_(y)] [Si or Ge or SiGe]_(z),        where RE is at least one rare-earth metal, x, y and z are real        positive numbers less than 5, and a majority of the dielectric        layer is a single crystal. A first semiconductor layer is        positioned between the first and second dielectric layers.

In another embodiment of the present invention, a high-k dielectricstructure for an integrated circuit includes first and second dielectriclayers. At least one of the layers is a high-k dielectric layer made ofa silicon rare-earth oxide, nitride, phosphide ternary or quaternaryalloy of the formula:

-   -   [(RE)_(x) (O or N or P) _(y)] [Si or Ge or SiGe]_(z), where RE        is at least one type of rare-earth metal, x, y and z are real        positive numbers less than or equal to 5, and a majority of the        dielectric layers are single crystal. A first semiconductor        layer is positioned between the first and second dielectric        layers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates one embodiment of a three dimensional atomicarrangement of a single crystal rare-earth oxide c-ErOx of the presentinvention.

FIG. 2(a) illustrates energy E 110 dispersion as a function of crystalmomentum k 120 of one embodiment of a single crystal rare-earth oxideEr_(x)O_(y), of the present invention.

FIG. 2(b) illustrates a single crystal bulk silicon semiconductor E-kdispersion.

FIG. 3(a) illustrates one embodiment of a silicon on insulator structure210 of the present invention.

FIG. 3(b) illustrates another embodiment of a silicon on insulatorstructure of the present invention 310.

FIG. 4 illustrates the double crystal x-ray diffraction curve of thesilicon-on-insulator structure disclosed in FIG. 3(b).

FIG. 5(a) illustrates the in-situ optical reflectance curve as afunction of deposition time for a single crystal erbium oxide layer forthe FIG. 3(a) structure.

FIG. 5(b) illustrates the double crystal x-ray diffraction curve of thesilicon-on-insulator structure disclosed in FIG. 3(a).

FIG. 5(c) illustrates the glancing incidence x-ray diffraction patternof the structure disclosed in FIG. 3(a).

FIG. 6 illustrates one embodiment of a silicon-on-insulator structure ofthe present invention using a superlattice.

FIG. 7 illustrates another embodiment of the present invention using atemplate growth method as applied to growth of single crystal 712 andpolycrystalline 714 erbium nitride (ErN).

FIGS. 8(a) and 8(b) are in-situ orthogonal azimuthal angle RHEED patternimages of layer 214 in FIG. 3(a).

FIG. 8(c) is a RHEED pattern image of the single crystal silicon layer212 grown over the single crystal erbium oxide layer 214 in FIG. 3(a).

FIGS. 8(d) and 8(e) as the same as FIGS. 8(a) and 8(b) except theyrepresent layer 314 in FIG. 3(b) with orthogonal azimuthal angles, for afixed incident electron beam.

FIG. 9 illustrates the room temperature photoluminescence emission ofthe structure disclosed in FIG. 4(b) under 980 nm optical pumping.

FIG. 10 illustrates a multilayer sequence composed of single crystalerbium oxide, of the present invention, constituting a wide band gap(WBG) layer 1010 and a single crystal silicon layer constituting thenarrow band gap (NBG) layer 1012.

FIG. 11 illustrates one embodiment of a transistor gate dielectricstructure 1110 of the present invention.

FIG. 12 illustrates one embodiment of a high-k dielectric structure 1210of the present invention.

DESCRIPTION OF THE EMBODIMENTS

In various embodiments, the present invention provides, (i) growthtechniques, (ii) epitaxial process steps, (iii) substantially singlecrystal rare-earth oxide compositions and structures, (iv) ternary andor quaternary rare-earth oxide compounds with Si and or Ge, (v) the useof unexcited molecular oxygen, excited metastable molecular oxygen,atomic oxygen, isotopically pure oxygen or a combination of these formsof oxygen, (vi) activated nitrogen species, molecular and or atomic,(vii) rare-earth oxynitride, (viii) substantially single crystal,polycrystal and or amorphous rare-earth nitrides and phosphides, (ix)ternary and or quaternary rare-earth nitrides and phosphides with Si andor Ge, (x) tunable electronic and optical band gap rare-earth compounds,(xi) multilayer structures of rare-earth compounds, such as rare-earthoxides, rare-earth nitrides, rare-earth oxynitrides, rare-earthphosphides, or mixtures thereof with Si, Ge and SiGe, and Si, Ge orsilicon-germanium alloys, (xii) material systems using any of thepreceding for a variety of devices including but not limited tointegrated electronic devices, passive photonic devices, electro-opticaldevices, magneto-optical devices, magneto-electronic devices, and thelike.

In one embodiment of the present invention, predominately single crystalgrowth of rare-earth metal oxides can require separate control of therelative oxygen and elemental metal fluxes for optimal deposition.Oxygen rich conditions with elemental metal can be advantageous forsingle crystal erbium oxide deposition. Furthermore, the heavyrare-earths, such as erbium and ytterbium in particular, can be simplyevaporated in elemental form using effusion cells and ceramic crucibles.A single RE-oxide EBE target or rare-earth precursor style MOCVD canrequire the supply of additional oxygen with unexcited molecular oxygen,excited molecular oxygen, or atomic oxygen, to provide that the growthconditions are oxygen rich or metal deficient conditions prevail, asmore fully described hereafter.

In one embodiment of the present invention, planar dual gate fieldeffect transistor structures are created using a multiple layerdeposition cycle comprising silicon and RE-oxide or RE-nitride orRE-phosphide (or ternaries with Si or Ge). The basic cyclic unit is theepitaxial deposition of substantially single crystal or polycrystallinesilicon onto a prior deposited high-k dielectric single crystalRE-oxides, RE-nitrides and RE-phosphides, or associated ternaries withSi or Ge onto substantially Si substrates.

In another embodiment of the present invention, planar dual gate fieldeffect transistor structures are provided and can be created using amultiple layer deposition cycle of silicon and RE-oxide or RE-nitride orRE-phosphide, or ternaries with Si or Ge. The basic cyclic unit is theepitaxial deposition of substantially single crystal or polycrystallinesilicon onto a prior deposited high-K dielectric single crystalRE-oxides, RE-nitrides and RE-phosphides, or associated ternaries withSi or Ge) onto substantially Si substrates, with a subsequent metalsilicide gate contact that can be by way of illustration and withoutlimitation, bulk erbium silicide, SiEr_(x), a multilayer ofsilicon/SiEr_(x), and the like, where x is a real positive number lessthan 2.

In one embodiment of the present invention, optically active structuresare provided using one or multiple layer deposition cycles of siliconand RE-oxide, RE-nitride, RE-phosphide or ternaries with Si or Ge. Thebasic cyclic unit can be the epitaxial deposition of substantiallysingle crystal or polycrystalline silicon onto a prior deposited high-Kdielectric single crystal RE-oxides, RE-nitrides and RE-phosphides, orassociated ternaries with Si or Ge, onto substantially Si substrates.

In one embodiment of the present invention, optically active structuresare provided that can be electronically excited to emit opticalradiation and or used for the conversion of optical radiation intoelectrons and or holes. This structure can employ one or multiple layerdeposition cycles of silicon and RE-oxide, RE-nitride, RE-phosphide orternaries with Si or Ge. The basic cyclic unit can be the epitaxialdeposition of substantially single crystal or polycrystalline silicononto a prior deposited high-K dielectric single crystal RE-oxides,RE-nitrides, RE-phosphides or associated ternaries with Si or Ge ontosubstantially Si substrates.

In another embodiment of the present invention, magnetically activestructures are provided using one or multiple layer deposition cycles ofsilicon and RE-oxide, RE-nitride, RE-phosphide or ternaries with Si orGe. The basic cyclic unit can be the epitaxial deposition ofsubstantially single crystal or polycrystalline silicon onto a priordeposited high-K dielectric single crystal RE-oxides, RE-nitrides,RE-phosphides or associated ternaries with Si or Ge, onto substantiallySi substrates.

In one embodiment of the present invention, highly efficient opticallypumped and or electro-optical devices are provided. In this embodiment,rare-earth metals are utilized as optically active elements, and therare-earth atoms are in the triply ionized (RE³+) state. If thiscondition is not met when the RE is introduced into a compound, the REis not optically active to the first order. This is due to the uniqueelectronic configuration of the 4f-shell of the rare earths. Therefore,optimal bonding co-ordination of the rare earth metal in oxide, nitride,phosphide or Si ternaries of the aforementioned compounds must result ina net removal of three electrons from the rare-earth metal, e.g., therare earth being is in a triply ionized state.

Rare-earth oxides can have a multiplicity of phases. The lighterrare-earth metals can form compounds with oxidation states RE+, RE²+,RE³+ and RE⁴⁺, amongst others. Only, the RE³⁺ state is optimal, andtherefore compounds of the formula RE+⁴⁰²-2, for example, are opticallyunremarkable. In various embodiments of the present invention, a heavymetal rare-earth oxide, by way of example using erbium oxide singlecrystal material, can be grown epitaxially on a multiplicity of Sisubstrates using the growth techniques described herein. Very strongoptical activity of the lowest lying 4 f-shell transition is indicativeof predominately RE³⁺ oxidation state in one embodiment of the presentinvention.

In one embodiment of the present invention, under suitable conditions,nitrogen forms strong RE-N bonds. The rare-earth nitride system has avery strong ionic character. In comparison to the rare-earth oxides, therare-earth nitride and phosphide compounds can exhibit substantiallyhigher probability of RE³⁺ oxidation states. In one embodiment of thepresent invention, nitrogen and phosphorus atoms have a very highaffinity for accepting three electrons when forming RE compounds. Anionswith N³⁻ and p³⁻ states can form rare-earth nitride and rare-earthphosphide compounds of the formula RE³⁺N³⁻ or RE³⁺P³⁻. In contrast, theheavier rare-earth oxides preferentially form RE³⁺ ₂O²⁻ ₃ compounds.

In another embodiment of the present invention, rare-earth oxy-nitride(RE-O-N) or rare-earth oxy-phosphides (RE-O-P) compositions are providedthat can be used to control the oxidation state of the rare-earth, andthereby control the electronic and optical properties of the material.By way of illustration, and without limitation, a single crystal and orpolycrystal erbium nitride (ErN) material, ErP compositions and the likeare provided.

In one embodiment of the present invention, rare-earth nitride ErN,rare-earth-phoshides, ErP binary compounds, and the like are providedand have a greater dispositio n to crystallize in substantially cubicand or wurtzite structures. This crystal symmetry group is well suitedto preferential epitaxial growth on diamond like crystal structures suchas the Si(001)-oriented surface, or related misoriented surfaces. Incontrast the rare-earth oxide of substantially RE₂O₃ type crystalstructure will have a greater disposition for crystallization onsubstantially hexagonal symmetry of the Si(111)-oriented surfaces.

In one embodiment of the present invention, selective nitridation(i.e.,: selectively introducing a nitrogen species) or phosphorization(i.e.,: selective introduction of a phosphorus species) of asubstantially rare-earth oxide compound can be used to modify the chargestate of the anion and cations of the initial compound. The reverse casealso holds true, that of selective oxidation of a substantially purerare-earth nitride or rare-earth phosphide compound. In this embodiment,a higher (lower) anion charge N³⁻ (O²⁻) can occur by gradualsubstitution of oxygen (nitrogen) in a rare-earth oxide (nitride)compound. For the rare-earth metals there are associated chargecompensation requirements. The anion charge compensation can beefficiently compensated by the addition of another species, includingbut not limited to, Si, Ge and the like. By way of illustration, andwithout limitation, a rare-earth ternary in the case of rare-earth oxidecan use introduction of 2N³⁻ that replaces 3O²⁻. For example, thenitridation transition from RE₂O₃ toward REN, requires the removal onaverage of 1.5 oxygen atoms for the insertion of each nitrogen atom inorder for charge neutrality to be conserved.

In one embodiment of the present invention, the above anion substitutionprocess is capable of altering the electronic band gap, electricalconductivity type, that is, hole p-type or electron n-type excess(character) and optical properties such as absorption and emissioncharacteristics. The excess electrical charge characteristics of thisprocess can be advantageously used in the construction of high electronand or hole mobility transistors and or for the manipulation of thequasi fermi-level of the material.

In another embodiment of the present invention, highly efficient tunablebandgap electronic and/or electro-optical devices are provided. In thisembodiment, quantum confinement structures are provided using periodicand non-periodic multiplayer hetero-structures, as well as with theselective ionization state of the rare-earth species. Band gapengineered compounds and or the 4f-shell electronic transitions of thetriply ionized rare-earth ions in the respective compounds are provided.

In one embodiment of the present invention, highly efficient tunableoptical gain materials are provided based on the rare-earth 4f-shellelectronic transitions. The emission and absorption characteristics arerelatively temperature independent compared to optical gain materialscomposed of group III-V and or III-nitride semiconductors.

In another embodiment of the present invention, highly efficient tunableoptical gain materials are provided. These can be based on theintersubband and intrasubband electronic transitions engineered byquantum well potentials generated by periodic or non-periodic structuresof wide band gap rare-earth oxide, rare-earth nitride, rare-earthphosphide and smaller band gap silicon and or germanium, and the like.Additionally, highly efficient tunable refractive index optical and orelectro-optical devices are provided and can be with cladding layers,optical core layers and optically active layers for passive and/oractive waveguides or cavities. The control of refractive index isimportant in guiding optical radiation in directions substantiallyplanar and or vertical directions to the layer growth direction.

In one embodiment of the present invention, multilayer constructions ofrare-earth oxides, rare-earth nitrides, rare-earth phosphides andsilicon are provided for the creation of a variety of devices. Suchdevices include, but are not limited to, electronic field effecttransistors, bipolar transistors, double or indeed multi gate FETtransistors, vertical integration of multi FET layer circuits, and thelike. In one embodiment of the present invention, highly efficientmagneto-optical, electromagnetically, and piezo-electrically drivendevices are provided. For example, paramagnetic and/or ferromagneticand/or ferrimagnetic devices are provided, based on the magneticproperties of the triply ionized rare-earth ions which form the hostrare-earth-oxide or rare-earth nitride or rare-earth phosphide activelayer or multilayers, and can further be controlled using electronic andor and or piezoelectric and or optical excitations or de-excitations.

In one embodiment of the present invention, is the integration of arare-earth quantum state prepared using the 4f-shell electronic energymanifold, that are controllable in character either/and optically and orelectronically and or magnetically, and yet further each said dressedquantum state imbedded in a photonic band gap structure, which iscapable of inhibiting or allowing optical coupling of the said dressedrare-earth quantum state. A functional quantum state as described aboveis the basic element or register of a quantum mechanical computingengine. Many such registers can be integrated using conventional siliconprocessing techniques. This potentially solves a long standing problemin the field of quantum computing.

In one embodiment of the present invention, substantially single-crystalrare-earth oxides (c-ErOx) are provided. In this embodiment, erbium ionsare suitably activated in the triply ionized state, and opticalabsorption and emission of the 4f-shell manifold is possible. Erbiumoxidizes and nitrides readily in a suitably activated atomicoxygen/nitrogen, metastable molecular oxygen/nitrogen and/or oxynitrideenvironment. The present invention includes new forms of c-ErOx andc-ErN that can be epitaxially formed on a silicon substrate, in singlecrystal form.

EXAMPLE 1

One structure for the epitaxial c-ErOx, representing the single crystalcomposition Er_(x)O_(y), is shown in FIG. 1, where x and y are realpositive numbers. In FIG. 1, the c-ErOx structure is a construction of asupercell with periodic boundary conditions and is generally denoted as10. The rare-earth atoms are represented as dark spheres 12 and thelighter spheres represent oxygen atoms 14. The layer-by-layer growthdirection 16 is co-incident with the crystal growth direction. A portionof one complete two-dimensional oxygen terminated layer is shown as 18.

Using a density functional theory plane-wave psuedopotential method andself-consistent minimization, an energy-momentum calculation isperformed. FIG. 2(a) illustrates energy E, denoted as 110, dispersion asa function of crystal momentum k, denoted as 120 of the single crystalrare-earth oxide ErxOy, of the present invention.

For comparison a bulk Si E-k curve is computed and shown in FIG. 2(b).c-ErOx has a quantitatively different band structure to that of bulk Si,primarily due to the type atomic symmetry and bonding. The band gap ofc-ErOx is about 6 eV and has a refractive index much lower than that ofSi, and can be about 1.7.

In one embodiment of the present invention, substantially single crystalerbium oxide compositions, their methods of formation and devicesincorporating the compositions, are provided, as further describedhereafter.

EXAMPLE 2

In one embodiment of the present invention, compositions are providedwhere nitrogen atoms with a very high affinity for accepting threeelectrons when forming RE compounds. That is, anions with N³⁻ electronicstates can form single crystal, polycrystal and amorphous rare-earthnitride compounds of the formula RE³⁺ N³—. Conditions suitable forpreparation RE-N compounds are for example using UHV environmentsuitable for deposition onto a substrate, an elemental RE source andsource of atomic nitrogen (N) and or metastable excited molecularnitrogen (N₂) and or unexcited molecular nitrogen gas (N₂).

Rare-earth nitride ErN binary compounds can have a greater dispositionto crystallize in substantially cubic and or wurtzite structures. Thiscrystal symmetry group is well suited to preferential epitaxial growthon diamond like crystal structures such as the Si(001)-oriented surface,or related misoriented surfaces. In one specific embodiment of thepresent invention, RE-N compounds are provided that alloy with otherelemental atoms. By way of example, and without limitation, alloyingRE-N with silicon and or germanium forms ternary compounds of theformula RE_(x)N_(y)Si_(z) and or RE_(x)N_(y)Ge_(z) The ternary compoundshave variable lattice constants and electronic band gaps as a functionof relative mole fraction, z, of Si and Ge.

EXAMPLE 3

In one embodiment, substantially single crystal, rare-earth phosphidecompositions are provided. Under suitable conditions phosphorous formsstrong ionic RE-P bonds. The phosphorous atoms or molecules have a veryhigh affinity for accepting three electrons when forming RE compounds.That is, anions with P³⁻ electronic states can form single crystal,polycrystal and amorphous rare-earth phosphide compounds of the formulaRE³⁺P³⁻. Conditions suitable for preparation RE-P compounds are, forexample, using UHV environment suitable for deposition onto a substrate,an elemental RE source, a source of atomic phosphorous (P), molecularphosphorous (P₂ and or P₄), sublimation of phosphide compounds, and thelike.

Rare-earth nitride ErP binary compounds can have a greater dispositionto crystallize in substantially cubic and or wurtzite structures. Thiscrystal symmetry group is well suited to preferential epitaxial growthon diamond like crystal structures such as the Si(001)-oriented surface,or related misoriented surfaces.

RE-P compounds can be alloyed with other elemental atoms. By way ofillustration, and without limitation, RE-P can be alloyed with siliconand or germanium to form ternary compounds of the formula:

-   -   RE_(x)P_(y)Si_(z), and or RE_(x)N_(y)Ge_(z) where x, y and z are        real positive numbers.

The ternary compounds can have a variable lattice constant andelectronic band gap as a function of relative mole fractions, z, of Siand or Ge.

EXAMPLE 4

In this example, multi rare-earth oxide, nitride, phosphide binaries areprovided. Multiple rare-earth metals can be incorporated into oxide,nitride and or phosphide based compounds. By way of illustration, andwithout limitation, RE₁=Er and RE₂=Yb can be co-deposited to formcompounds of the chemical formula:

-   -   [Er_(z)Yb_(1-z)]_(x) [O or N or P]_(y), where z is the relative        fraction of Er and Yb. This technique can be extended to several        REs to form    -   [RE₁, RE₂, . . . RE₃]_(x) [O or N or P] y, where x and y are        real positive numbers. The spatial and chemical composition can        be varied as a function of growth direction.

EXAMPLE 5

In this example, rare-earth oxynitride compounds can be formed byintroducing oxygen and or nitrogen and or nitrous oxide (N₂O or NO)species during deposition. Compounds exhibiting the chemical formulasubstantially of the formula:

-   -   [RE]_(x) [O_(1-z)N_(z)]_(y) can form either unique single        crystal or polycrystal or amorphous structures.

EXAMPLE 6

In this example, rare-earth oxide, nitride and or phosphide can bealloyed with other elements including but not limited to, group IVnon-metals, such as Si and or Ge. Compositions exhibiting the chemicalformula:

-   -   [(RE)_(x) (O or N or P)_(y)] [Si or Ge or SiGe]_(z) are provided        using the above techniques for RE-[O, N, P] deposition and        further co-deposition using elemental sources of Si and or Ge.        For example, the introduction of elemental Si and Ge can be used        to manipulate the electronic and structural properties of the        compound. Another example is the co-deposition using silane        (SiH₂) or germane (GeH₂) gaseous precursors during deposition.        Yet another example is the post growth of Si and or Ge onto the        said RE oxide, nitride or phosphide followed by annealing to        form the ternary. In one embodiment of the present invention the        spatial and chemical composition can be varied as a function of        growth direction. Specific crystal structures, isomorphs,        electronic band structure, magnetic and optical properties can        be achieved by varying the relative chemical ratio of the        constituents of the composition. Specifically, the lattice        constant and or electronic nature of the composition can be        advantageously varied to allow low defect density single crystal        deposition onto dissimilar materials. The electronic properties        of the composition can be advantageously varied from        substantially insulating to semiconducting by introducing        greater amounts of Si and Ge. The electronic nature of the        composition can be further manipulated to exhibiting conducting        behavior by introducing greater amounts of rare-earth ions and        or using charge compensation methods as described above.

EXAMPLE 7

This example illustrates that in one embodiment of the presentinvention, the highest quality of substantially single crystallinestructures of the present invention are grown when a so-called “templategrowth” process is employed. In this process, a layer of material of atleast one type of rare-earth (RE), rare-earth oxide (RE_(x)O_(y)),rare-earth nitride (RE_(x)N_(y)), rare-earth phosphide (RE_(x)P_(y));silicides formed by silicon (or germanium, or SiGe) alloyed withrare-earth (RE_(x)(Si,Ge)_(y)), rare-earth OxyNitride (RE_(x)(O,N)_(y)),or rare-earth OxyPhosphide (RE_(x)(O,P)_(y)); silicon nitride(Si_(x)N_(y)); silicon oxide (SiO_(y)); germanium oxide (GeO_(y));germanium nitride Ge_(x)N_(y); germanium phosphide (Ge_(x)Py); elementalSi and or Ge; is used as a template upon which the compositions of thepresent invention grown. For example, in the growth of c-ErOx, optimalgrowth can be achieved using a pure-crystal Erbium template 220 grownover a single crystalline silicon oxide layer c-SiOx 218, where x isless than 1, as shown in FIG. 3(a).

FIG. 3(a) illustrates one embodiment of a silicon-on-insulator structure210 of the present invention. A single crystalline silicon layer 212 isepitaxially deposited onto a single crystal (ErxOy) layer 214. Layers212 and 214 are grown on a silicon (111)-oriented substrate, denoted as216. Substantially pure-crystal template layers 218 and 220 are grownover a substantially single crystalline silicon buffer layer 222, forone embodiment of the present invention. Normally incident and reflectedoptical radiation 226 is used to monitor the multilayer stack as afunction of deposition time.

FIG. 3(b) illustrates another embodiment of a silicon-on-insulatorstructure 310 of the present invention. In this embodiment, asubstantially single crystalline silicon layer 312 epitaxially depositedonto a single crystal (Er_(x)O_(y)) layer 314. Layers 312 and 314 aregrown on a silicon (100)-oriented substrate 316. Pure-crystal templatelayers 318 and 320 are grown over a single crystalline silicon bufferlayer 322, for one embodiment of the present invention.

It will be appreciated that a number of templates can be used, includingbut not limited to, Si_(1-z)(Er_(x)O_(y))_(z), (where x, y and z arereal positive numbers) grown over a rare-earth Silicide (SiEr_(v) wherev is a real positive number less than 2), as shown in FIG. 3(b).

FIG. 4 illustrates the double crystal x-ray diffraction curve of thesilicon-on-insulator structure disclosed in FIG. 3(b). The peak labeled412 represents the single crystal silicon 004 reflection and the welldefined narrow peak 410 represents the high quality single crystalerbium oxide 002 reflection. The absence of any other erbium oxiderelated peaks indicates the erbium oxide layer is isomorphic and singlecrystal.

FIG. 5(a) illustrates the in-situ optical reflectance curve as afunction of deposition time for a single crystal erbium oxide layer. Amonochromatic light source is used in the configuration disclosed inFIG. 3(a). The oscillations describe a growing surface with thicknessincreasing as a function of deposition time. Peaks indicate constructiveinterference and valleys indicate destructive interference.

FIG. 5(b) illustrates the double crystal x-ray diffraction curve of thesilicon-on-insulator structure disclosed in FIG. 3(a). Curves 510 and512 indicate a high quality single crystal erbium oxide layer has beenepitaxially deposited on to a silicon substrate. Curve 510 represents asilicon-on-insulator structure with thicker single crystal erbium oxidelayer beneath the top single crystal silicon layer than curve 512. Thesingle crystal silicon peak is shown as 514.

FIG. 5(c) illustrates the glancing incidence x-ray diffraction patternof the structure disclosed in FIG. 3(a). The ripples as a function ofangle indicate an atomically flat structure.

Sophisticated structures such as superlattices can be grown, andsignificantly enhanced using this template growth technique. FIG. 6illustrates one embodiment of a silicon-on-insulator structure 610 ofthe present invention using a superlattice. Structure 610 includes amultilayer, superlattice structure 612 composed of crystalline erbiumoxide 614 and germanium layer 616 constructions.

The lattice constants of the erbium oxide 614 and germanium 616 aresubstantially different. Single crystal defect free multi-layers areformed by balancing the tetragonal distortion of the epitaxiallydeposited films. The superlattice layer thicknesses are chosen so thatequal and opposite strain forces in each layer substantially cancelresulting in a reduced strain or strain free superlattice 612. Thisallows a single crystal superlattice structure of total thicknesssubstantially larger than the critical layer thickness of pure Ge to bedeposited directly onto Si.

The superlattice structure 612 is grown on a silicon erbium oxidetemplate layer 618 and an erbium silicide template layer 620 of oneembodiment of the present invention. A single crystal silicon cap layer622 is deposited over the superlattice structure 612. The multilayersare grown on a silicon buffer layer 624 which is deposited on a silicon(100)-oriented substrate 626.

In various embodiments, the superlattices of the present invention canhave a substrate and a plurality of repeating units, at least a portionof the repeating units being at least one of:

-   -   1. a rare-earth oxide of the formula: (RE_(x)O_(y)), where x and        y are real positive numbers less than or equal to 3;    -   2. a rare-earth nitride of the formula: (RExNy) where x and y        are real positive numbers less than or equal to 2;    -   3. a rare-earth phosphide of the formula: (RExPy) where x and y        are real positive numbers less than or equal to 2;    -   4. a rare-earth silicide of the formula: (RE_(x)Si_(y)), where x        and y are real positive numbers less than or equal to 2;    -   5. a rare-earth oxynitride of the formula:        (RE_(x)[O_(z)N_(1-z)]_(y), where x and y are individually real        positive numbers less than or equal to 3 and z is a real        positive number less than or equal to 1;    -   6. a rare-earth oxyphoshide of the formula:        (RE_(x)[O_(z)P_(1-z)]_(y)) where x and y are individually real        positive numbers less than or equal to 3 and z is a real        positive number less than or equal to 1;    -   7. a rare-earth germanium alloy of the formula, (RE_(x)Ge_(y))        where x and y are real positive numbers less than or equal to 3;    -   8. a rare-earth-germnium-oxide-nitride-phosphide of the formula:        (RE_(x)[O or N or P]_(y)Ge_(z)), where x, y and z are real        positive numbers less than or equal to 3;    -   9. a germanium nitride of the formula: (Ge_(x)N_(y)) where x and        y are real positive numbers less than or equal to 5;    -   10. a germanium oxide of the formula: (Ge_(x)O_(y)) where x and        y are real positive numbers less than or equal to 3; and    -   11. a rare-earth-silicon-oxide-nitride-phosphide of the formula:        (REx [O or N or P]_(y)Si_(z)), where x, y and z are real        positive numbers less than or equal to 3.    -   12. a silicon nitride of the formula: (Si_(x)N_(y)), where x and        y are real positive numbers less than or equal to 5.    -   13. a silicon oxide of the formula: (Si_(x)O_(y)), where x and y        are real positive numbers less than or equal to 2.

This template growth method is also employed to grow materials with acontrolled and highly specific ratio of crystalline to polycrystallinestructure. The template growth method of this Example 7 can be used tocreate a continuous transition between pure single-crystalline structurethrough polycrystalline and finally to amorphous structure all in asingle growth run. FIG. 7 shows this template growth method, as appliedto erbium nitride growth with a Si_(1-z)(Er_(x)O_(y))_(z) template,where x, y and z are real positive numbers, for anothersilicon-on-insulator structure 710 of the present invention. In FIG. 7substantially single crystal structure 712 and polycrystalline erbiumnitride (ErN) 714 are provided. The erbium nitride layers were depositedon to a single crystal erbium oxide buffer layer 716. The erbium oxidebuffer layer 716 was deposited on template layers composed of singlecrystal silicon erbium oxide 718 and erbium silicide 720. A top mostsilicon layer 722 was used to terminate the multilayer sequence. Themultilayer structure was deposited on a silicon buffer layer 724 whichis deposited on a silicon (100)-oriented substrate 726.

The single crystal ErN layer 712 has a different lattice constant to thesingle crystal erbium oxide buffer layer 716. As the ErN layer 712increases in thickness beyond the critical layer thickness (CLT), misfitdislocations occur and polycrystalline ErN (pc-ErN) 714 occurs. Thetransition from single crystal to polycrystalline ErN growth is depictedto occur at the region between 716 and 712. Furthermore, thepolycrystalline silicon cap layer 722 can be deposited over thepolycrystalline ErN layer 714. It should be noted that if the CLT is notexceeded for ErN growth on single crystal erbium oxide, then singlecrystal ErN can be obtained. It is therefore possible for single crystalsilicon to be deposited on the single crystal ErN layer 712. The singlecrystal silicon layer can be advantageously grown to be in a state oftension and or compression. That is, strained layer silicon can beformed, thereby comprising a strained SOI structure. In one embodimentof the present invention, a single crystal ErN can be epitaxiallydeposited directly on top of Si(001)-oriented surfaces with and withoutmiscut oriented surfaces upto six degrees.

EXAMPLE 8

This example discusses various growth tools that can be utilized withthe compositions, and devices of the present invention.

The RHEED pattern is used to advantage in growth of these new materialsand structures, and proves conclusively that all of these new materialsare indeed high quality low defect density pure single-crystal. FIGS.8(a) and 8(b) are in-situ orthogonal azimuthal angle RHEED patternimages of layer 214 in FIG. 3(a). The long sharp RHEED streaks 810, 812and 814 indicate excellent quality single crystal erbium oxide andtwo-dimensional layer-by-layer growth. The RHEED streaks 812 through 814are clearly defined, long and parallel. In contrast, RHEED fromrare-earth oxides grown according to the prior-art shows either no RHEED(amorphous) or highly diffuse spotty and or halo RHEED patterns(polycrystalline). The contrast between the RHEED patterns andsubsequently the crystalline verses highly polycrystalline and oramorphous structures is clear. The inventor's method clearly produceshigh quality single-crystal structures, while the prior are capable onlyof duplicating those materials found in nature, e.g., highlypolycrystalline or amorphous materials.

FIG. 8(c) is a RHEED pattern image of the single crystal silicon layer212 grown over the single crystal erbium oxide layer 214 in FIG. 3(a).RHEED images 816 through 838 of the layer 212 in FIG. 3(a) are shown forazimuthal crystal axis rotated in 30 degree increments, for a fixedincident electron beam. The images 816 through 838 indicate high qualitysingle crystal Si 212 has been epitaxially deposited over the wide bandgap single crystal erbium oxide insulator layer 214.

FIGS. 8(d) and 8(e) are the same as FIGS. 8(a) and 8(b) except theyrepresent layer 314 in FIG. 3(b) with orthogonal azimuthal angles, for afixed incident electron beam. The images show long sharp streaks 840,842 and 844 indicating single crystal erbium oxide has been deposited ina 2×1 reconstruction.

Single crystal silicon can be advantageously grown onto wide band gapinsulating films composed of single crystal rare-earth oxide. The SOIstructures can be realized onto silicon substrates with substantially(001)-oriented surfaces, (111)-oriented surfaces, miscut surfaces withorientation deviated from either (001)-, (111)- or (011)-orientedsurfaces.

Epilayer growth was monitored in-situ using real-time RHEED and nearnormal incidence reflectivity. Typical base pressure of the UHV systemwas

-   -   about 1-3×10⁻¹¹ torr. Effusion cells were used for the        evaporation of 4N⁺-purity Er and 6N-purity Ge. Ultra low beam        pressure plasma sources were used for the production of atomic        and meta-stable oxygen and nitrogen species. Gas species and Si        fluxes were monitored and stabilized using residual gas        analyzers or optical emission sensors. Si was evaporated using        high stability rod-fed or crucible electron beam evaporators.

Single crystal rare-earth oxides were grown on RCA cleaned Si(111)substrates. Clean Si surfaces were terminated with either a wet grownprotective SiO₂ layer or were H-terminated using a final HF dip.Substrates were out gassed in UHV and then loaded in to the growthchamber. Prior to deposition, substrates were heated to 900° C. untilclear 7×7 surface reconstructions were observed by RHEED. Base pressurein the growth chamber during oxide removal never exceeded 2×10⁻¹⁰ torr.After UHV annealing for 1-15mins the substrate was rapidly cooled togrowth temperature for buffer layer deposition of about 1000 Angstromsof intrinsic Si. RHEED exhibited very sharp, long and narrow streaksindicative of atomically flat and well defined Si surface. FIGS. 3(a)and 3(b) show schematically typical layer sequences deposited onSi(111)- and Si(001)-oriented substrates, respectively. Process sequencedescribed in FIG. 3(b) has been grown at 500 and 700 degrees centigrade.Process sequence described in FIG. 3(b) has been grown at 500 and 700degrees centigrade. A thermodynamically stabilized sequence of layerswas grown to establish an atomic template prior to the growth of apseudomorphic c-ErOx layer, representing the single crystal compositionEr_(x)O_(y) where x and y are real positive numbers. At no time didRHEED streaks disappear or was there any evidence of polycrystalline oramorphous growth. The single crystal rare-earth oxide and nitride filmscan be grown in the temperature range of 300 to 1000 degrees centigrade.The single crystal silicide layers can be grown at 300 to 800 degreescentigrade. Clearly, the deposition temperature of the process iscompatible with standard CMOS processing.

In one embodiment of the present invention, a method is provided usingRHEED patterns to provide feedback to the growth process. Since thesematerials have never been grown before in single-crystal form, then itfollows that these techniques have never been previously applied to thisprocess.

EXAMPLE 9

In one embodiment of the present invention, photoluminescence (PL) isused for analyzing semiconductor wafers by changing the excitationwavelength of the PL tool from green (532 nm) to blue (488 nm), orinfrared (980 nm), or ultraviolet (355 nm). Due to the pure-crystalnature of these rare earth oxides, nitrides, and phosphides, uponexcitation with these new wavelengths, the wafers exhibit strongphotoluminescence (PL) at wavelengths previously unavailable fromsilicon, even at room temperature. For example, when the rare earth usedis erbium, these new materials emit strongly in the 1400 to 1680 nm bandused for telecommunications. FIG. 9 shows the photoluminescence emissionunder 980 nm pumping, noting the distinct emission peaks, 910 through926, which mark the specific transitions of the triply ionizedrare-earth 4-f manifold. In an amorphous material, such as an erbiumdoped fiber, this splitting is impossible to observe. With oneembodiment of the present invention, this characteristic is used as aprecise tool for measuring crystallinity of the final structure. PL canbe used as a non-invasive probe for optical signature identification ofrare-earth materials.

In one embodiment of the present invention, rapid thermal anneal (RTA)techniques are used to modify the crystal quality of rare-earth filmsand or activate electrical dopants.

In another embodiment of the present invention, Raman scattering isutilized with short wavelength excitation for analyzing the crystalquality of epitaxially deposited thin films. By way of illustration, andwithout limitation, utrathin Si films deposited on single crystalrare-earth oxides, nitrides or phosphides are probed non-invasively forquality assessment. The very high optical absorption co-efficient in Siat short wavelengths (<400 nm) allows Raman spectra to be acquired fromthe topmost epilayer of an SOI structure created using the presentinvention.

In another embodiment of the present invention, atomic layer epitaxy(ALE) is utilized. The c-ErOx, c-ErN (representing the single crystalcompounds Er_(x)O_(y) and Er_(x)N_(y)), growth parameters can bemanipulated such that the growth proceeds in a 2-dimensionallayer-by-layer (2D-LbL) mode, controlled primarily by the metaldeposition rate. The 2D-LbL growth mode is most advantageous for thedeposition and growth of thin single crystal films with substantiallyhighly uniform thickness across the substrate. ALE has been demonstratedby the inventor using a UHV chamber, a heated substrate disposedadvantageously infront of elemental atomic and or molecular depositionsources, a method to modulate the source flux seen by the growing film,and a means of characterizing in-situ film quality. The c-ErOx surfacecan also be self terminated in a molecular oxygen and or nitrogen excessenvironment. An oxygen terminated c-ErOx surface has been observed toremain stable for periods up to 2 hours at elevated growth temperaturesin excess of 700° C. and chamber pressures <10⁻⁹ torr.

EXAMPLE 10

In another embodiment of the present invention, a multilayer structurecomprising of an alternating sequence of wide band gap (WBG) energymaterial and narrow band gap (NBG) energy material can be constructed.By way of example, FIG. 10 illustrates a multilayer sequence composed ofsingle crystal erbium oxide 1010, of the present invention, constitutingthe WBG layer, and single crystal silicon 1012 constituting the NBGlayer. The vertical axis represents the electronic energy 1014 and thehorizontal axis represents the layer growth direction 1016. Theelectronic band gap energy of erbium oxide 1010 is much greater than theband gap of silicon 1018 and therefore the silicon potential welleffectively confines electrons and or holes in the NBG layer. Forsufficiently thin layers, of the order of the deBroglie wavelength,quantized energy levels will occur in the potential well region. Theelectronic quantized energy levels 1020 and 1022 are shown due to theelectronic confinement potentials 1024 and 1026. An optical transition1028 between quantized energy levels energy is shown. Other compositionsof the present invention can be advantageously applied to achievedesired electronic, optical and or magnetic properties. The opticaltransition 1028 can equivalently occur by electronic recombination fromenergy levels between the conduction and valence band.

In various embodiments of the present invention, compositions areprovided of the following formulas:

-   -   (1) a rare-earth oxide of the formula: [RE]_(x) [O]_(y), where x        is 1 and y is 1.5, RE is at least one type of rare-earth metal        atom and a majority of the composition is a single crystal.    -   (2) a binary single-crystal rare-earth nitride of the formula:        RE_(x)N_(y) where x is 1 and y is 1, RE is at least one type of        rare-earth metal atom, and a majority of the binary rare-earth        nitride is single crystal;    -   (3) a binary single-crystal rare-earth phosphide of the formula:        RE_(x)P_(y) where x is 1 and y is 1, RE is at least one        rare-earth metal atom, and a majority of the binary rare-earth        phosphide is single crystal;    -   (4) a rare-earth oxy-nitride ternary of the formula [RE]_(x)        [O_(1-z) N_(z)]_(y) where x and y are real positive numbers less        than 3 and z is greater or equal to zero and less than equal to        1, RE is at least one type of rare-earth metal atom, and a        majority of the composition is single crystal;    -   (5) a silicon rare-earth oxide, nitride, phosphide ternary or        quaternary alloy of the form:    -   [(RE)_(x) (O or N or P)_(y)] [Si or Ge or SiGe]_(z), where RE is        at least one rare-earth metal, x, y and z are real positive        numbers less than 5 and a majority of the composition is a        single crystal;    -   (6) a ternary alloy of a non rare-earth metal atom with either        rare-earth oxide, rare-earth nitride or rare-earth phosphide of        the form:        [(RE), (O or N or P)_(y)] μM]_(z), where RE is at least one type        of rare-earth metal, M is a non-rare-earth, x, y and z are real        positive numbers less than 5 and a majority of the composition        is a single crystal;

These compositions can, (i) have an arrangement of atoms with asubstantially single ordered structure, (ii) be non-polycrystalline,(iii) be non-amorphous, (iv) vary from single-crystal topolycrystalline, and the like.

The specific formula configuration of each compound can be usedadvantageously to achieve a desired lattice constant, band gap energy,dielectric constant, refractive index, heterojunction offset and thelike.

The specific formula configuration of each compound can be usedadvantageously to achieve a desired lattice constant, band gap energy,dielectric constant, refractive index, heterojunction offset and thelike.

For composition (1), x may take values ranging from 1 to 2, and y cantake the values of 1.5 and 3, that is, 1.0<=x<=2.0 and 1.5<=y<=3.0. Therange of values are chosen to represent stoichiometric and ornon-stoichiometric rare-earth oxides that are possible in singlecrystalline form. The crystal structural forms can be monoclinic,hexagonal, wurtzite, body centered cubic and others.

For example, the polymorph single crystal structures represented asRE_(x=1)O_(y=1), RE_(y=1)O_(y=2), RE_(x=2)O_(y=3), RE_(x=1),O_(y), where1<=y<=3, and or RE_(x=1)O_(2-k) where 0<=k<=2 are all possible.

By way of example, it is also understood that intermediate rare-earthoxides such as RE₆O₁₁, can be also represented as combinations of theabove polymorphs as RE₂O₃. 4 (REO₂).

As a further example of composition (1), the crystal structurerepresented by RE_(x=1)O_(y=1.5+d), where d is a real positive numberwould indicate a non-stoichiometric crystal structure that is oxygenrich. Conversely, the crystal structure represented byRE_(x=1)O_(y=1.5−d), where d is a real positive number, would representa non-stoichiometric crystal structure that is oxygen deficient.

For composition (2) x and y are equal to one. Further, x and y can takethe values greater or equal to 1 and less than or equal to 2,representing stoichiometric and or non-stoichiometric rare-earthnitrides that are possible in crystalline form. The structural forms canbe monoclinic, hexagonal, wurtzite, body centered cubic and others.

As a further example of composition (2), the crystal structurerepresented by RE_(x=1)N_(y=1+d), where d is a real positive numberwould indicate a non-stoichiometric crystal structure that is nitrogenrich. Conversely, the crystal structure represented byRE_(x=1)N_(y=1−d), where d is a real positive number, would represent anon-stoichiometric crystal structure that is nitrogen deficient.

A further example of composition (2) are the polymorph single crystalstructures represented as RE_(x=1)N_(y=1), and RE_(x=1)N_(y), where1<=y<=2.

For composition (3) x and y are equal to one. Further, x and y can takethe values greater or equal to 1 and less than or equal to 2,representing stoichiometric and or non-stoichiometric rare-earthnitrides that are possible in crystalline form. The structural forms canbe monoclinic, hexagonal, wurtzite, body centered cubic and others.

As a further example of composition (3), the crystal structurerepresented by RE_(x=1)P_(y=1+d), where d is a real positive numberwould indicate a non-stoichiometric crystal structure that is phosphorusrich. Conversely, the crystal structure represented byRE_(x=1)P_(y=1−d), where d is a real positive number, would represent anon-stoichiometric crystal structure that is phosphorus deficient.

Further examples of composition (3) are the polymorph single crystalstructures represented as RE_(x=1)P_(y=1), and RE_(x=1)P_(y), where1<=y<=2.

For composition (4) x can have values between 1 and 2 (1<=x<=2), y canhave values between 1 and 5 (1<=y<=5), and z can be chosen from 0<=z<=1.

A further example of composition (4) is the empirical formula for amixed oxy-nitride rare-earth ternary crystal structure of the form:

(RE₂O₃)_(a)(RE₁N₁)_(b) where a and b are positive integers or realnumbers, and may also be written as RE_((2a+b))O_((3a))N_((b)).Stoichiometric and non-stoichiometric crystalline structures are alsopossible. The structural forms can be monoclinic, cubic, hexagonal,wurtzite, body centered cubic and others. Advantageous incorporation ofN into the rare-earth oxide structure can be used to modify thediffusion of oxygen through the crystal lattice. It has been found thatonly a few percent or less N incorporation in Er (O_(x)N_(1-x))_(1.5)compounds, where x>0.9 can substantially reduce oxygen diffusion.

For composition (5) x can have values ranging from 1 to 2, y can havevalues ranging from 1.5 to 3, and z can be chosen from 0<=y<=2. Thestructural forms can be monoclinic, cubic, hexagonal, wurtzite, bodycentered cubic and others.

Further examples include compositions using silicon oxides of the formsilicon dioxide SiO₂, silicon monoxide SiO and substoichiometric SiO_(v)

-   -   where v is a positive number less than 1.

An example of composition (5) is (SiO₂)_(x).(Er₂O₃)₁ x, where x is areal positive number less than or equal to 1, and can be equivalentlydescribed by the formula Si_(x)Er_(2(1-x))O_((3-x)).

Another example of composition (5) is (SiO)_(x).(Er₂O₃)_(1-x), where xis a real positive number less than or equal to 1, and can beequivalently described by the formula Si_(x)Er_(2(1-x))O_((3-2x)).

Another example of composition (5) is (SiO)_(x).(ErO)_(1-x), where x isa real positive number less than or equal to 1, and can be equivalentlydescribed by the formula Si_(x)Er_(1-x)O.

Similarly, silicon nitride compositions can be used such as Si₃N₄, Si₁N₁or SiN_(v), where v is a positive number less than or equal to 2.5.

Another example of composition (5) is (SiN)_(x).(ErN)_(1-x), where x isa real positive number less than or equal to 1, and can be equivalentlydescribed by the formula Si_(x)Er_(1-x)N.

For composition (6), M is preferentially chosen from one or more ofhafnium, zirconium or aluminum. By way of example and withoutlimitation, the case of composition (6) as a single crystal oxide usingHafnium (Hf) is disclosed. The formula parameter z is chosen to be lessthan or equal to one and the RE species is chosen as Er. This alloy issubstantially single crystal and allows the properties of hafnium to beadvantageously utilized in single crystal form.

As a further example of composition (6) the composition(HfO₂)_(x).(Er₂O₃)_(1-x), where x is a real positive number less than orequal to 1, and can be equivalently described by the formulaHf_(x)Er_(2(1-x))O_((3-x)).

Yet another example of composition (6) is the composition(HfO₂)_(x).(Er₁N₁)_(1-x), where x is a real positive number less than orequal to 1, and can be equivalently described by the formulaHf_(x)Er_((1-x))O_(2x)N_(1-x).

Another example of composition (6) is the composition(HfN)_(x).(Er₁N₁)_(1-x), where x is a real positive number less than orequal to 1, and can be equivalently described by the formulaHf_(x)Er_((1-x))N.

Rare-earth elements can be immediately preceding hafnium in the periodictable to add electrons to the inner 4 f-shell. Because no outerelectrons are added to compensate for the increased nuclear charge thereis a contraction in atomic size. This is the well known “Lanthanidecontraction”.

In another embodiment of the present invention, single crystalrare-earth oxides (and rare-earth nitrides) are provided that arecapable of advantageously stabilizing the cubic (fluorite) structure ofhafnium oxide (hafnium nitride).

In various embodiments, each of the compositions can be, (i) at least90% single crystal, (ii) at least 95% single crystal, (iii) at least 99%of single crystal, and the like.

The rare-earth can be any rare earth including but not limited to erbiumand ytterbium, each of which can have atoms bonded in the triply ionized(3+) state.

In one embodiment, the compositions are grown on a structure orsubstrate made from at least one of, silicon, germanium and silicongermanium, GaAs, InP, SiC and Al₂O₃. In another embodiment, thecompositions are grown on an amorphous substrate, including but notlimited to, SiO₂, or a substantially amorphous ceramic and the like.

A layer can be formed on top of the compositions. Suitable materials forthe layer include but are not limited to, silicon, germanium,silicon-germanium alloy and the like. In various embodiments, at least,(i) 90% of the layer is single crystal, 95% of the layer is singlecrystal, (iii) 99% of the layer is single crystal, and the like.

In other embodiments of the present invention, the compositions of (1)through (6) above, as well as all of their different embodiments, can beutilized in the structures of FIGS. 3(a), 3(b), 6 and 7. In theseembodiments, a substantially single crystal active layer silicon oninsulator material is the minimum requirement for SOI applied to ULSItechnologies. A further improvement to current SOI technologies is theintroduction and use of a single crystal insulator layer beneath theaforementioned silicon active layer. A further feature of the presentinvention is the in-situ epitaxial growth of single crystal rare-earthoxide and or rare-earth nitride and or rare-earth phosphide. Using thegrowth technique of the present invention, a single crystal rare-earthinsulator can be deposited as an ultrathin film or bulk layer and thefinal surface will be atomically flat with well defined crystalsymmetry. Further, a pure single crystal silicon and/or germanium and/orcompound silicon-germanium active layer can be grown epitaxially on topthis single crystal insulator layer. The interfacial quality between thesingle crystal Si active layer and the crystalline insulator canpotentially have a very low defect density. Under the correct conditionsthis crystalline oxide/Si layer sequence can be grown on Si substrates.

The structures of FIGS. 3(a), 3(b), 6 and 7 may have another rare-earthoxide, nitride or phosphide layer deposited on top in-situ to form anSOI and or high-k gate oxide stack. This structure would preserve theactive Si layer and gate oxide interface quality. Alternatively, anamorphous and or polycrystalline gate oxide, such as SiO_(x)N_(y) may beused. Regardless, a double gate FET structure could be readily realized.

A further utility of the single crystal rare-earth oxide, nitride orphosphide for use as a FET gate oxide replacement is in the area gatestack dopant diffusion. Typically, conventional FET processes flows usea doped polycrystalline Si gate contact layer deposited onto the SiO₂gate oxide. Unfortunately, to activate the dopant in the polycrystallineSi contact layer very high temperatures are required. During the annealor activation the dopant species, for example Boron atoms, deleteriouslymigrate into the gate oxide. For ultrathin SiO₂ gate oxides this is asevere limitation. The present invention potentially solves thisproblem. If single crystal rare-earth oxide is used as the FET gatedielectric layer(s), subsequent deposition of appropriately doped singlecrystal Si can be used as the gate contact layer. The advantage of thisprocess flow is that dopant species diffusivity is lower in singlecrystal Si than in amorphous or polycrystalline Si. Therefore, theproblem of dopant penetration from the gate stack into the gatedielectric layer is reduced or removed.

In other embodiments of the present invention, the large heterojunctionvalence and conduction band offsets exhibited by using silicon andrare-earth oxides and or nitrides allows quantum confinement of chargecarriers to occur. By way of illustration, and without limitation, amultilayer sequence such as described in FIG. 10, is provided thatincludes at least one period of c-ErOx/Si/c-ErOx. For Si layer thicknessof the order of the electron deBroglie wavelength about 100 Angstroms,the narrow band gap Si potential well has quantized energy levels in theconduction and valence bands. This is analogous to gallium arsenide(GaAs)/gallium aluminum arsenide (GaAIAs) quantum well. However, thec-ErOx/Si/c-ErOx quantum well offers advantageously increased electronand hole confinement energies of several electron volts.

For the extended case of many periods of c-ErOx/Si/c-ErOx and individuallayer thickness less than about 100 Angstroms, the quantum wells becomecoupled and electronic minibands form in the conduction and valencebands. The quantum well analogy of the present invention allows for thefirst time complex quantum electronic materials to be realized in thesilicon system. Similar condition hold true for single crystalrare-earth nitrides, phosphides and ternaries described above.

A further aspect of the present invention is that both the active Silayer and buried insulator thicknesses can be individually depositedwith thickness ranging from a few angstroms to several microns.Therefore, SOI structures can have optimized active Si layer and BOXlayer thickness. This aspect is unique to the present invention whenapplied to fully depleted silicon-on-insulator substrates. The BOX layeris an insulator with high dielectric constant and therefore need only beseveral nanometers in thickness.

A further advantage of the present invention applied to SOI substratesusing rare-earth metal oxide BOX layer is in the area of thermaldissipation. The thermal conductivity of SiO₂ is approximately onehundred times lower than single crystal Si. It is well known thatsubmicron transistor self-heating effects are problematic in ULSI FETsimplemented on conventional SOI substrates. The present inventionpotentially alleviates this self-heating problem as the rare-earth metaloxides, nitrides and or phosphides exhibit substantially higher thermalconductivity than SiO₂.

A further aspect of the present invention is a multiple layer periodicor aperiodic sequence or permutation of epitaxial growth of rare-earthoxide and or rare-earth nitride and or rare-earth phosphide and/orsilicon and/or silicon-germanium.

In other embodiments of the present invention, the electronic transistorgate dielectric structures for an integrated circuit is disclosed. FIG.11 illustrates one embodiment of an electronic transistor gatedielectric structure 1110 of the present invention. A first insulatorand or dielectric layer 1118 is grown over a template layer and orbuffer 1120. The dielectric layer 1118 is a single crystal rare-earthcontaining layer according to compositions of (1) through (6) above. Afirst semiconductor layer 1116 is deposited upon the first dielectriclayer 1118. The semiconductor layer 1116 is preferably a single crystalsemiconductor epitaxially deposited upon the single crystal dielectriclayer 1118 according to the present invention. The multi-layers aredeposited over a substrate 1122. A second dielectric layer 1112 isdeposited over the first semiconductor layer 1116. This basic layersequence forms a single crystal semiconductor layer 1116 sandwiched bytwo dielectric layers. This basic structure is used to form a fieldeffect transistor that is disposed upon an insulating substrate.Alternatively, the said structure forms a double gate field effecttransistor. At least one of the dielectric layers 1112 and 1118 are madeof the compositions of (1) through (6) above, as well as their variousembodiments. The semiconductor layer 1116 is chosen preferentially as asingle crystal silicon and or germanium layer. Each of the dielectriclayers 1112 and or 1118 can be made of the single crystal compositionsof (1) through (6) above, as well as their various embodiments.

Structures 1110 can have repeating units. By way of illustration, athird dielectric layer 1117 and a second semiconductor layer 1114 aredeposited. If the second dielectric layer 1112 is made of the singlecrystal compositions of (1) through (6) above, then the secondsemiconductor layer can be single crystal in structure. Thesemiconductor layer 1114 is positioned between the second and thirddielectric layers 1117 and 1112, respectively.

It will be appreciated that four or more dielectric layers can beprovided. The third dielectric layer can be made of the compositions of(1) through (6) above. Therefore, it is clear that the use of singlecrystal compositions of (1) through (6) above, allows construction ofsingle crystal multi-layers of semiconductor and insulator sequences,thereby allowing the entire structure to be single crystal.

Preferably, the substrate 1122 is chosen from single crystal silicon.The first semiconductor layer is chosen from single crystal silicon andor germanium. The first dielectric layer 1118 is chosen fromsubstantially single crystal compositions of (1) through (6) above.

In other embodiments of the present invention, high-k dielectricstructures for an integrated circuit, generally denoted as 1210 andillustrated in FIG. 12, are provided. FIG. 12 illustrates one embodimentof a high-k dielectric structure of the present invention 1210. Asubstantially single crystal insulator layer 1218 is grown over atemplate and or buffer layer 1220. The multi-layers are deposited over asubstrate 1222. A first single crystal semiconductor layer 1216 isepitaxially deposited upon the first dielectric layer 1218. Second 1212and third 1214 dielectric layers are deposited upon the firstsemiconductor layer 1216. Further, optional second semiconductor layer1213 is deposited upon dielectric layers 1212 and 1214.

At least one of the dielectric layers 1218, 1214 and or 1212 is a high-kdielectric layer made of the compositions of (1) through (6) above, aswell as their various embodiments.

In one specific embodiment, the substrate 1222 is single crystalsilicon. The dielectric layer 1218 is a single crystal insulatoraccording to the present invention compositions of (1) through (6)above. Semiconductor layer 1216 is a single crystal silicon and orgermanium active layer. At least one of the dielectric layers 1212 and1214 are high-k single crystal insulator layers according to presentinvention compositions of (1) through (6) above. Semiconductor layer1213 is a single crystal gate contact layer composed of doped-siliconand or silicide. Other embodiments of the present invention are the useof conventional dielectric layers, such as silicon oxynitrideSiO_(x)N_(y) and or hafnium oxynitride HfO_(x)N_(y), as the second andor third dielectric layers. The use of conventional dielectric layers asthe third dielectric layer 1214 would necessarily limit the the secondsemiconductor layer 1213 to be other than a single crystalsemiconductor.

Structures 1210 can have repeating units and it will be appreciated thatfour or more dielectric and semiconductor layers can be provided.

In other embodiments of the present invention, Si micro- andnano-electronic devices, similar to structures 1110 and 1210, areprovided. Such devices can include are not limited to, double gate fieldeffect transistors (FETs), vertical gate FETs (such as FinFETs),electronic memories, magnetic sensors and storage, semiconductor opticalamplifiers, semiconductor photodetectors, semiconductor lasers and thelike.

The foregoing description of various embodiments of the presentinvention has been presented for purposes of illustration anddescription. It is not intended to be exhaustive or to limit theinvention to the precise forms disclosed. Obviously, many modificationsand variations will be apparent to practitioners skilled in this art. Itis intended that the scope of the invention be defined by the followingclaims and their equivalents.

1. A field effect transistor gate dielectric structure for an electronicintegrated circuit, comprising: first and second dielectric layers, atleast one of the layers being made of a rare-earth oxide of the formula:[RE]_(x) [O]_(y), where x and y are real positive numbers, RE is atleast one type of rare-earth metal atom and a majority of thecomposition is a single crystal; and a first semiconductor layer ispositioned between the first and second dielectric layers.
 2. The gatedielectric structure of claim 1, wherein each of the first and seconddielectric layers is made of a rare-earth oxide of the formula: [RE]_(x)[O]_(y), where x and y are real positive numbers, RE is at least onetype rare-earth metal atom and a majority of the composition is a singlecrystal.
 3. The gate dielectric structure of claim 1, furthercomprising: a third dielectric layer; and a second semiconductor layerthat is positioned between the second and third dielectric layers. 4.The gate structure of claim 3, wherein the third dielectric layer ismade of a rare-earth oxide of the formula: [RE]_(x) [O]_(y), where x andy are real positive numbers, RE is at least one type of rare-earth metalatom and a majority of the composition is a single crystal.
 5. A high-kdielectric structure for an electronic integrated circuit, comprising:first and second dielectric layers, at least one of the layers being ahigh-k dielectric layer made of a rare-earth oxide of the formula:[RE]_(x) [O]_(y), where x and y are real positive numbers less than orequal to five, RE is at least one type of rare-earth metal atom, and amajority of the composition is a single crystal; and a firstsemiconductor layer is positioned between the first and seconddielectric layers.
 6. The high-k dielectric structure of claim 5,wherein each of the first and second dielectric layers is made of arare-earth oxide of the formula: [RE]_(x) [O]_(y), where x and y arereal positive numbers, RE is at least one type of rare-earth metal atom,and a majority of the composition is a single crystal.
 7. The high-kdielectric structure of claim 5, further comprising: a third dielectriclayer; and a second semiconductor layer is positioned between the secondand third dielectric layers.
 8. The high-k dielectric structure of claim7, wherein the third dielectric layer is made of a rare-earth oxide ofthe formula: [RE]_(x) [O]_(y), where x and y are real positive numbers,RE is at least one type of rare-earth metal atom, and a majority of thecomposition is a single crystal.
 9. A field effect transistor gatedielectric structure for an electronic integrated circuit, comprising:first and second dielectric layers, at least one of the layers beingmade of a binary single-crystal rare-earth nitride of the formula: REx Ny where x and y are real positive numbers less than or equal to two, REis at least one type of rare-earth metal atom, and a majority of thebinary rare-earth oxide is single crystal; and a first semiconductorlayer is positioned between the first and second dielectric layers. 10.The gate dielectric structure of claim 9, wherein each of the first andsecond dielectric layers is made of a binary single-crystal rare-earthnitriide of the formula: RE_(x)N_(y) where x and y are real positivenumbers, RE is at least one type of rare-earth metal atom, and amajority of the binary rare-earth oxide is single crystal.
 11. The gatedielectric structure of claim 9, further comprising: a third dielectriclayer; and a second semiconductor layer is positioned between the secondand third dielectric layers.
 12. The gate structure of claim 11, whereinthe third dielectric layer is made of a binary single-crystal rare-earthnitriide of the formula: RE_(x)N_(y) where x and y are real positivenumbers, RE is at least one type of rare-earth metal atom, and amajority of the binary rare-earth oxide is single crystal.
 13. A high-kdielectric structure for an electronic integrated circuit, comprising:first and second dielectric layers, at least one of the layers being ahigh-k dielectric layer made of a binary single-crystal rare-earthnitriide of the formula: RE_(x)N_(y) where x and y are real positivenumbers, RE is at least one type of rare-earth metal atom, and amajority of the binary rare-earth nitride is single crystal; and a firstsemiconductor layer is positioned between the first and seconddielectric layers.
 14. The high-k dielectric structure of claim 13,wherein each of the first and second dielectric layers is made of abinary single-crystal rare-earth nitriide of the formula: RE_(x)N_(y)where x and y are real positive numbers, RE is at least one type ofrare-earth metal atom, and a majority of the binary rare-earth nitrideis single crystal.
 15. The high-k dielectric structure of claim 13,further comprising: a third dielectric layer; and a second semiconductorlayer is positioned between the second and third dielectric layers. 16.The high-k dielectric structure of claim 15, wherein the thirddielectric layer is made of a binary single-crystal rare-earth nitriideof the formula: RE_(x)N_(y) where x and y are real positive numbers, REis at least one type of rare-earth metal atom, and a majority of thebinary rare-earth nitride is single crystal.
 17. A field effecttransistor gate dielectric structure for an electronic integratedcircuit, comprising: first and second dielectric layers, at least one ofthe layers being made of a binary single-crystal rare-earth phosphide ofthe formula: RE_(x)P_(y) where x and y are real positive numbers, RE isat least one type of rare-earth metal atom, and a majority of the binaryrare-earth phosphide is single crystal; and a first semiconductor layeris positioned between the first and second dielectric layers.
 18. Thegate dielectric structure of claim 1, wherein each of the first andsecond dielectric layers is made of a binary single-crystal rare-earthphosphide of the formula: RE_(x)P_(y), where x and y are real positivenumbers, RE is at least one type of rare-earth metal atom, and amajority of the binary rare-earth phosphide is single crystal.
 19. Thegate dielectric structure of claim 17, further comprising: a thirddielectric layer; and a second semiconductor layer is positioned betweenthe second and third dielectric layers.
 20. The gate structure of claim19, wherein the third dielectric layer is made of a binarysingle-crystal rare-earth phosphide of the formula: RE_(x)P_(y) where xand y are real positive numbers, RE is at least one type of rare-earthmetal atom, P is phosphorus and a majority of the binary rare-earthphosphide is single crystal.
 21. A high-k dielectric structure for anelectronic integrated circuit, comprising: first and second dielectriclayers, at least one of the layers a high-k dielectric layer made of abinary single-crystal rare-earth phosphide of the formula: RE_(x)P_(y)where x and y are real positive numbers, RE is at least one type ofrare-earth metal atom, P is phosphorus and a majority of the binaryrare-earth phosphide is single crystal; and a first semiconductor layeris positioned between the first and second dielectric layers.
 22. Thehigh-k dielectric structure of claim 21, wherein each of the first andsecond dielectric layers is made of a binary single-crystal rare-earthphosphide of the formula: RE_(x)P_(y) where x and y are real positivenumbers, RE is at least one type of rare-earth metal atom, P isphosphorus and a majority of the binary rare-earth phosphide is singlecrystal.
 23. The high-k dielectric structure of claim 21, furthercomprising: a third dielectric layer; and a second semiconductor layeris positioned between the second and third dielectric layers.
 24. Thehigh-k dielectric structure of claim 23, wherein the third dielectriclayer is made of a binary single-crystal rare-earth phosphide of theformula: RE_(x)P_(y), where x and y are real positive numbers, RE is atleast one type of rare-earth metal atom, P is phosphorus and a majorityof the binary rare-earth phosphide is single crystal.
 25. A field effecttransistor gate dielectric structure for an integrated circuit,comprising: first and second dielectric layers, at least one of thelayers being made of a rare-earth oxy-nitride ternary of theformula[RE]_(x) [O_(1-z)N_(z)]_(y) where x, y and z are real positivenumbers less than or equal to five, RE is at least one type rare-earthmetal atom, and a majority of the dielectric insulator layer is singlecrystal; and a first semiconductor layer is positioned between the firstand second dielectric layers.
 26. The gate dielectric structure of claim1, wherein each of the first and second dielectric layers is made of arare-earth oxy-nitride ternary of the formula[RE]_(x)[O_(1-z)N_(z)]_(y)where x and y are real positive numbers less than or equal to five and zis greater than zero and less than or equal to 1, RE is at least onetype rare-earth metal atom, and a majority of the dielectric insulatorlayer is single crystal.
 27. The gate dielectric structure of claim 1,further comprising: a third dielectric layer; and a second semiconductorlayer is positioned between the second and third dielectric layers. 28.The gate structure of claim 27, wherein the third dielectric layer ismade of a rare-earth oxy-nitride ternary of the formula[RE]_(x) [O_(1-z)N_(z)]_(y) where x and y are real positive numbers less than or equal tofive, z is greater than zero and less than or equal to 1, RE is at leastone type rare-earth metal atom, and a majority of the dielectricinsulator layer is single crystal.
 29. A high-k dielectric structure foran electronic integrated circuit, comprising: first and seconddielectric layers, at least one of the layers being a high-k dielectriclayer made of a rare-earth oxy-nitride ternary of the formula[RE]_(x)[O_(1-z) N_(z)]_(y) where x and y are real positive numbers less than orequal to five, z is greater than zero and less than or equal to 1, RE isat least one type rare-earth metal atom, and a majority of thedielectric insulator layer is single crystal; and a first semiconductorlayer is positioned between the first and second dielectric layers. 30.The high-k dielectric structure of claim 8, wherein each of the firstand second dielectric layers is made of a rare-earth oxy-nitride ternaryof the formula[RE]_(x) [O_(1-z)N_(z)]_(y), x and y are real positivenumbers less than or equal to five, z is greater than zero and less thanor equal to 1, RE is at least one type rare-earth metal atom, and amajority of the dielectric insulator layer is single crystal.
 31. Thehigh-k dielectric structure of claim 29, further comprising: a thirddielectric layer; and a second semiconductor layer is positioned betweenthe second and third dielectric layers.
 32. The high-k dielectricstructure of claim 31, wherein the third dielectric layer is made of arare-earth oxy-nitride ternary of the formula[RE]_(x) [O_(1-z)N_(z)]_(y)where x and y are real positive numbers less than or equal to five, z isgreater than zero and less than or equal to 1, RE is at least one typerare-earth metal atom, and a majority of the dielectric insulator layeris single crystal.
 33. A field effect transistor gate dielectricstructure for an electronic integrated circuit, comprising: first andsecond dielectric layers, at least one of the layers being made of asilicon rare-earth oxide and or silicon rare-earth nitride and orsilicon rare-earth phosphide ternary or quaternary alloy of the form:[(RE)_(x) (O or N or P)_(y)] [Si or Ge or SiGe]_(z), where x, y and zare real positive numbers less than or equal to 5, RE is at least onetype of rare-earth metal, and a majority of the dielectric insulatorlayer is a single crystal; and a first semiconductor layer is positionedbetween the first and second dielectric layers.
 34. The gate dielectricstructure of claim 33, wherein each of the first and second dielectriclayers are made of a silicon rare-earth oxide and or silicon rare-earthnitride and or silicon rare-earth phosphide ternary or quaternary alloyof the formula: [(RE)_(x) (O or N or P)_(y)] [Si or Ge or SiGe]_(z),where x, y and z are real positive numbers less than or equal to 5, REis at least one type of rare-earth metal, and a majority of thedielectric insulator layer is a single crystal.
 35. The gate dielectricstructure of claim 33, further comprising: a third dielectric layer; anda second semiconductor layer is positioned the second and thirddielectric layers.
 36. The gate structure of claim 35, wherein the thirddielectric layer is made of silicon rare-earth oxide and or siliconrare-earth nitride and or silicon rare-earth phosphide ternary orquaternary alloy of the form: [(RE)_(x) (O or N or P)_(y)] [Si or Ge orSiGe]_(z), where x, y and z are real positive numbers, less than 5, REis at least one type of rare-earth metal, and a majority of thedielectric insulator layer is a single crystal.
 37. A high-k dielectricstructure for an electronic integrated circuit, comprising: first andsecond dielectric layers, at least one of the layers being a high-kdielectric layer made of a silicon rare-earth oxide and or siliconrare-earth nitride and or silicon rare-earth phosphide ternary orquaternary alloy of the form: [(RE)_(x) (O or N or P)_(y)] [Si or Ge orSiGe]_(z), where RE is at least one type of rare-earth metal, x, y and zare real positive numbers less than or equal to five, and a majority ofthe dielectric insulator layer is a single crystal; and a firstsemiconductor layer is positioned between the first and seconddielectric layers. 38 The high-k dielectric structure of claim 37,wherein each of the first and second dielectric layers is made of asilicon rare-earth oxide and or silicon rare-earth nitride and orsilicon rare-earth phosphide ternary or quaternary alloy of the form:[(RE)_(x) (O or N or P)_(y)] [Si or Ge or SiGe]_(z), where RE is atleast one type of rare-earth metal, x, y and z are real positive numbersless than or equal to five, and a majority of the dielectric insulatorlayer is a single crystal.
 39. The high-k dielectric structure of claim37, further comprising: a third dielectric layer; and a secondsemiconductor layer is positioned between the second and thirddielectric layers.
 40. The high-k dielectric structure of claim 39,wherein the third dielectric layer is made of a silicon rare-earth oxideand or silicon rare-earth nitride and or silicon rare-earth phosphideternary or quaternary alloy of the form: [(RE)_(x) (O or N or P)_(y)][Si or Ge or SiGe]_(z), where RE is at least one type of rare-earthmetal, x, y and z are real positive numbers less than or equal to five,and a majority of the dielectric insulator layer is a single crystal.